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Platform01 Thermal · SAPCA

Heat is the limit. The sea is the sink.

Each generation of AI hardware draws more power into less space. Air cannot carry that heat away, and chillers spend power that should reach the compute. SAPCA moves heat off the silicon through a sealed two-phase circuit and rejects it to sea water, the largest heat sink available to a coastal site.

StageEngineering concept complete NextPhase 0 boiling-qualification rig IP10 US applications, April 2026
Fig. 1 · SAPCA in 3DLive model
Loop 1Sealed podSub-atmospheric
Vapour inCondenser
Loop 2Plate HX
Loop 3Sea water
Drag to rotate

Sealed pod, condenser, plate heat exchanger, sea water.

Thermal path

Three loops from silicon to the sea.

Heat leaves the cold plates as vapour, condenses into a secondary loop and leaves the site through a plate heat exchanger to open sea water.

A

Sealed two-phase circuit

Coolant boils at the cold plate under sub-atmospheric pressure, carrying heat as vapour with no compressor in the primary path.

B

Serviceable like a standard rack

Servers sit in a dry bay at atmospheric pressure with standard power and fibre connectors. Service is front-of-rack.

C

800 VDC from the ground up

Native high-voltage DC distribution cuts conversion stages and copper, sized for 1 MW-class racks.

D

Built to stack

Sealed pods stack vertically, which lets a gigawatt-class campus sit on a compact coastal footprint.

Fig. 2 · Thermal pathSchematic
SAPCA thermal path: heat moves from the cold plates in a sealed pod, through a condenser and a secondary loop, to a sea-water heat exchanger. SEALED POD COLD PLATES AT SUB-ATMOSPHERIC PRESSURE CONDENSER LIQUID RETURN VAPOUR SECONDARY LOOP PLATE HX OUTFALL INTAKE SEA WATER
Loop 1 · sealed two-phase Loop 2 · secondary Loop 3 · sea water
Specification

The numbers it is built to hold.

At the design target, cooling and power overhead falls from about half a watt for every watt of compute to between three and six hundredths. Targets are engineering goals, not measured results.

ParameterValueBasis
Cooling methodSub-atmospheric two-phaseArchitecture
Primary loopSealed, no compressorArchitecture
Heat sinkSea water, open loopArchitecture
Server bayDry, atmospheric pressureArchitecture
Target PUE1.03 to 1.06Design target
Power distribution800 VDC nativeDesign target
Rack class1 MWDesign target
Fig. 3 · Facility overheadW per W of compute
Industry norm, PUE near 1.50.50 W
SAPCA target, PUE 1.060.06 W
SAPCA target, PUE 1.030.03 W

Overhead per watt delivered to compute equals PUE minus 1. One scale for all bars. SAPCA values are design targets.

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